Semiconductor Engineer (KTP Associate)

Main Duties and Responsibilities:

1. Designing and prototyping advanced packaging concepts, with scale up in mind and transferring these best practices to Neuranics so that expertise for the design and fabrication of packaged TMR sensors can be embedded in the company.
2. Designing and fabricating a TMR sensor for 2.5D and 3D integration for a reliable demonstrator.
3. Undertaking CAD electrical and thermal design for future package design and leading on scale-up.
4. Developing Accelerated Life Testing (ALT) protocols and test setups for ongoing reliability tests of packaged TMR sensors.
5. Develop project and time management skills in an interdisciplinary environment, allowing the associate to work to commercial deadlines.
6. Participate in commercial meetings to ensure technical specifications are appropriately.

To embed semiconductor packaging and reliability‑testing expertise within Neuranics, delivering high‑quality sensor samples that meet required performance and stability standards, and enabling high‑volume production of AI‑driven sensor systems.